Святлодыёдныя стужкі SMD і COB У чым розніца?
What is the difference between coB downlights and LED downlights
1. Different technology
Leds are solid-state semiconductor devices that convert electricity directly into light. Led, as the third generation of lighting technology after incandescent lamp and fluorescent lamp, has the characteristics of energy saving, environmental protection, safety and reliability.
Cob light source is directly attached to the led chip high reflective rate of mirror surface of high photosynthetic efficiency of metal substrate integrated light source technology, the technology to eliminate the concept of stents, electroless plating, reflow soldering, SMT process, so the process to reduce by almost a third, cost savings by a third, popular terms is more advanced than led lights, and the lamp that shield an eye.
2. Different lighting
Led lights can save energy, environmental protection, no strobotron no ULTRAVIOLET radiation, the disadvantage is blue light harm. Cob lamp high color rendering, light color close to natural color, no stroboscopic, no glare, no electromagnetic radiation, no ultraviolet radiation, infrared radiation, can protect eyes and skin.
Cob advantages
1. Advantages of production and manufacturing efficiency
The production process of COB packaging is basically the same as that of traditional SMD production process. The efficiency of COB packaging is basically the same as that of SMD packaging in the process of solid crystal and welding line. Аднак, the efficiency of COB packaging is much higher than that of SMD products in dispensing, separation, splitting and packaging.
The labor and manufacturing cost of traditional SMD packaging is about 15% of the material cost, while the labor and manufacturing cost of COB packaging is about 10% of the material cost. With COB packaging, the labor and manufacturing cost can be saved by 5%.
2, low thermal resistance advantage
The system thermal resistance of traditional SMD packaging application is: chip – solid crystal gel – solder joint – solder paste – copper foil – insulation layer – aluminum material. COB package system thermal resistance: chip – solid crystal gel – aluminum. The system thermal resistance of COB package is much lower than that of traditional SMD package, which greatly improves the life of LED.
. 3, light quality advantage
Traditional SMD packages attach multiple discrete components to THE PCB in the form of patches to form light source components for LED applications, which has problems of spot light, glare and glow-out. COB packaging is integrated packaging, is a surface light source, перавагай з'яўляецца вялікі кут агляду і лёгкая рэгуляванне, паменшыць страты на праламленне святла
Прыведзеныя вышэй вынікі перакладу атрыманы з параўнання сказаў па сказах Youdao Neural Network Translation (YNMT).
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